必发365



  • DRAM芯片

  • ECC DRAM

  • FLASH 产品

  • 模组产品

  • DRAM KGD

  • 嵌入式DRAM

  • 云彣UniWhen

  • SSD

  • DRAM芯片

    SDR
    DDR
    DDR2
    DDR3
    DDR4
    LPDDR2
    LPDDR4
    LPDDR4x
    PSRAM
  • ECC DRAM

    DDR
    DDR2
    DDR3
    LPDDR4
    LPDDR4x
  • FLASH 产品

    SPI NAND
    MCP
  • 模组产品

    SO-DIMM
    U-DIMM
    R-DIMM
    NV-DIMM
  • DRAM KGD

  • 嵌入式DRAM

  • 云彣UniWhen

  • SSD

    DRAM芯片

  • SDR
  • DDR
  • DDR2
  • DDR3
  • DDR4
  • LPDDR2
  • LPDDR4
  • LPDDR4x
  • PSRAM

SDR

SDRAM(同步动态随机存取存储器)广泛应用于工业控制、电力、医疗、特种电子等领域。

Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
SCB33S512800AE

512Mb

64Mbx8

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S512160AE

512Mb

32Mbx16

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S512320AE

512Mb

16Mbx32

3.3V

TSOPⅡ86

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S256800AE

256Mb

32Mbx8

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S256160AE

256Mb

16Mbx16

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S256320AE

256Mb

8Mbx32

3.3V

TSOPⅡ86

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S128800AE

128Mb

16Mbx8

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S128160AE

128Mb

8Mbx16

3.3V

TSOPⅡ54

11.76x22.22

MP

167/133

C I A3 A2

IBIS

SCB33S128320AE

128Mb

4Mbx32

3.3V

TSOPⅡ86

11.76x22.22

MP

167/133

C I A3 A2

IBIS

Releted DocumentExcel SheetPart No. Decoder销售渠道

Notes

  • Temperature Specification:

    C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)

    I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)

    A1 = Automotive grade 1(-40°C ~ +125°C)

    A2 = Automotive grade 2(-40°C ~ +105°C)

    A25 = Automotive grade 2(-40°C ~ +115°C)

    A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)



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